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Resultados de la Wikipedia en inglés.
- wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made…5 kB (668 palabras) - 05:47 14 ene 2024
- optical interconnects refers to any system of transmitting signals from one part of an integrated circuit to another using light. Optical interconnects have…4 kB (395 palabras) - 01:24 16 abr 2024
- applications like smart TVs. 2.5D packaging can enable hundreds of thousands of interconnects within a small package space. This packaging technology is used in applications…12 kB (1321 palabras) - 19:38 26 jul 2023
- IPC (electronics) (redirección desde Institute for Interconnecting and Packaging Electronic Circuits)to the Institute for Interconnecting and Packaging Electronic Circuits to highlight the expansion from bare boards to packaging and electronic assemblies…8 kB (721 palabras) - 23:26 26 feb 2024
- focused on die and 1st level interconnects. IPC-9071A attempted to address this by focusing on 2nd level interconnects (i.e. package to PCB substrate). The…15 kB (1874 palabras) - 00:12 28 mar 2024
- Through-silicon via (sección 3D packages)image sensor wafer to form interconnects, eliminate wire bonds, and allow for reduced form factor and higher-density interconnects. Die stacking came about…15 kB (1733 palabras) - 23:22 29 abr 2024
- techniques for interconnecting several chips within a single package have been proposed and researched: SiP (system in package) PoP (package on package) 3D-SICs…62 kB (3406 palabras) - 18:22 6 abr 2024
- Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect packaging technology that utilizes “nodule” structures that extend…7 kB (758 palabras) - 20:31 22 abr 2024
- neighboring circuits. Finally, the package must permit interconnecting the chip to a PCB. The materials of the package are either plastic (thermoset or…15 kB (1597 palabras) - 20:25 22 abr 2024
- solved by utilizing optical interconnects to replace the long metallic interconnects. Such hybrid optical/electronic interconnects promise better performance…3 kB (342 palabras) - 23:13 4 dic 2023
- In nanotechnology, carbon nanotube interconnects refer to the proposed use of carbon nanotubes in the interconnects between the elements of an integrated…39 kB (4726 palabras) - 05:48 16 abr 2024
- Three-dimensional integrated circuit (categoría Packaging (microfabrication))advanced packaging techniques stacking IC chips using TSV interconnects, and monolithic 3D ICs, which use fab processes to realize 3D interconnects at the…77 kB (8378 palabras) - 18:40 1 may 2024
- board members. A common chiplet interconnect specification enables construction of large System-on-Chip (SoC) packages that exceed maximum reticle size…5 kB (420 palabras) - 03:50 27 abr 2024
- Microvias are used as the interconnects between layers in high density interconnect (HDI) substrates and printed circuit boards (PCBs) to accommodate…10 kB (1344 palabras) - 18:38 4 feb 2024
- resistance of the interconnects constituting the network, there is a voltage drop across the network, commonly referred to as the IR-drop. The package supplies…10 kB (1424 palabras) - 20:27 16 abr 2024
- devices (PLDs). They consist of an array of programmable logic blocks and interconnects that can be configured to perform various digital functions. FPGAs are…56 kB (6037 palabras) - 03:27 25 abr 2024
- Integrated circuit (sección Packaging)2022[update], 5 nm transistors. Copper interconnects where copper wiring replaces aluminum for interconnects. Low-κ dielectric insulators. Silicon on…81 kB (8770 palabras) - 21:56 1 may 2024
- Semiconductor device fabrication (sección Packaging)interconnects. In 2014, Applied Materials proposed the use of cobalt in interconnects at the 22nm node, used for encapsulating copper interconnects in…104 kB (10 972 palabras) - 07:43 6 may 2024
- Electromigration (sección Electromigration due to IR drop noise of the on-chip power grid network/interconnect)is named. At the time, the metal interconnects in ICs were still about 10 micrometres wide. Currently interconnects are only hundreds to tens of nanometers…36 kB (4570 palabras) - 20:10 25 mar 2024
- insulation purposes) and metal layers (for the interconnect tracks). The vias between layers and the interconnects on the individual layers are thus formed…5 kB (479 palabras) - 06:14 21 abr 2024
- high-frequency performance due to reduced package interconnect parasitics, higher system reliability, smaller package count, and higher integration of RF components…6 kB (792 palabras) - 21:54 17 ene 2021